Browse our complete portfolio organized by five core technology categories. Find the right components for your design.
Industry-leading V-NAND flash solutions spanning from automotive-grade UFS to consumer eMMC, delivering industry-best write endurance and sequential speeds.
High-bandwidth, low-power DRAM solutions for mobile, server, and AI accelerator applications. LPDDR5X achieves 8.5Gbps with 50% power reduction vs LPDDR5.
Purpose-built SSD controllers enabling next-gen NVMe SSDs with hardware-rooted security, advanced LDPC ECC, and smart power management for data center workloads.
Micron's 232-layer 3D NAND delivers best-in-class areal density and write performance for client and edge computing storage applications.
Industry's first 1β (1-beta) DRAM node in mass production, enabling 50% higher memory bandwidth and 25% better power efficiency for AI and high-performance computing.
High-speed Octal SPI and xSPI-compliant NOR flash for automotive ADAS, industrial IoT, and 5G front-haul where execute-in-place code storage is critical.
Industry's lowest-noise zero-drift operational amplifiers for precision instrumentation, weigh scales, and medical diagnostic equipment.
Best-in-class precision ADCs and DACs for test & measurement, defense radar, and scientific instrumentation. The AD7606C 16/18-channel DAS is an industry benchmark.
Highly integrated µModule (micromodule) regulators combining MOSFETs, inductors, and controllers in a single BGA package. Silent Switcher technology eliminates EMI.
Full signal chain solutions for 5G mmWave, phased-array radar, and satellite communications. Industry-leading integrated transceivers reduce BOM by 50%.
Monolithic and module DC-DCs renowned for ultra-high power density, fast transient response, and minimal EMI. Used in server PSUs, base stations, and motor drives worldwide.
Highly integrated motor control ICs combining gate drivers, power stages, and control logic. MPS Halleffect sensorless BLDC drivers reduce system cost by 30%.
Fully integrated multi-cell lithium battery management ICs with passive/active cell balancing, autonomous cell monitoring, and ASIL-D safety compliance.
The gold standard for general-purpose and precision signal chain. TI amplifiers offer the widest portfolio, best-in-class specs, and immediate availability from authorized stock.
From 16-bit 1MSPS SAR ADCs to 14-bit 10GSPS RF DACs, TI covers the full precision-to-high-speed data converter spectrum with proven reference designs.
From 100mA low-noise LDOs to multi-phase 500W DC-DCs, TI's power portfolio is unmatched in breadth. GaN-based high-power converters enable 3× power density improvement.
Sitara MPUs for industrial HMI and edge computing, C2000 DSPs for real-time power conversion control, and MSP430 for ultra-low-power sensing — complete embedded coverage.
The world's most popular 32-bit MCU family. STM32 spans ultra-low-power STM32L0/L4 to high-performance STM32H7, with wireless STM32W for IoT — all with single-vendor simplicity.
SPC5 automotive microcontrollers integrate Vcore power stages and gate drivers on a single die for BCM, motor control, and powertrain management — reducing PCB area by 40%.
ST's MEMS sensors power smartphones, wearables, drones, and industrial condition monitoring. The LSM6DSV 6-axis IMU with AI-core enables on-sensor gesture recognition.
Scalable applications processors from cost-optimized i.MX 6ULL (Cortex-A7) to high-performance i.MX 8QuadMax (Cortex-A72 + GPU) for automotive IVI, industrial HMI, and edge AI.
Domain/zonal E/E architecture processors for software-defined vehicles. S32G gateway processors handle vehicle cloud connectivity and real-time body control simultaneously.
Purpose-built network processors for switches, routers, 5G RAN, and edge computing. Layerscape QorIQ family delivers wire-speed packet processing with hardware trust architecture.
Elite SiC MOSFETs and SiC Schottky barrier diodes for EV traction inverters, OBCs, and solar PV inverters. onSemi's SiC technology is IATF16949 certified for automotive production.
High-voltage IGBTs for motor drives and inverters, and superjunction MOSFETs for server SMPS and telecom power. Wide package options including PressFit and EVpak for automotive.
Factory-integrated power module solutions combining IGBT or SiC switches with gate drivers, shunt resistors, and temperature sensing in a single rugged package.
Europe's largest discrete semiconductor supplier. Nexperia MOSFETs cover everything from sub-1Ω load switching to ultra-low Rds(on) synchronous rectification in advanced LFPAK/EPC packages.
Automotive-grade 650V GaN HEMTs in Nexperia's proprietary Trench Gate technology, achieving 10× better figure-of-merit vs silicon SJ-MOSFETs in a highly reliable, AEC-Q101-qualified package.
The industry-standard logic family — over 300 logic functions from gates to bus switches, level translators, and voltage supervisors. Available in tiny 6-pin packages to QFN40.
TDK InvenSense MEMS IMUs dominate in drones, TWS earbuds, AR/VR, and automotive ADAS. The IAM-20685 6-axis automotive-grade IMU meets ASPICE and AEC-Q100 Grade 2.
Ultra-compact MEMS pressure sensors for wearable blood pressure, industrial process control, and automotive MAP/BMAP sensors. InvenSense barometers achieve ±0.5hPa absolute accuracy.
TDK's Tunneling Magnetoresistance (TMR) sensors offer 100× better sensitivity than conventional Hall sensors, enabling precise position sensing in automotive BLDC motor commutation.
Automotive-grade (AEC-Q200) inductors, common-mode chokes, and integrated magnetic components for EV OBC, DC-DC converters, and CAN/LIN bus EMI suppression.